1 10

LAMPRO

RNII Series

RNII Series

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Features

  • Flip chip LED offers high stability, brightness
  • Low power use and strong contrast
  • Pixel-level bin mixing for 360° uniform viewing
  • large modules reduce seams (better flatness, easier installation)
  • COB treatment adds robust protection and comfortable viewing
  • High-strength die-casting aluminium cabinet
  • MIP's 0404 small package enables 15,000:1 high contrast
  • High grayscale & High refresh rate
  • Module Fast locks
  • Support creative corners and arcs
  • Handles & Lifting handle, easy to carry
  • Front/Rear easy maintenance & Installation.

 

Specifications:

Parameter
RNII1.5
RNII1.9
RNII2.6
Pixel Configuration
SMD+GOB
MIP
U-SHIELD
Pixel Pitch (mm)
1.5
1.9
2.6
Pixels Per Panel
320x320
256x256
192x192
Pixel density(pixels/sq.m.)
409,600
262,144
147,456
Cabinet Dimensions (WxHxD)/ (mm)
500x500x74
Module Dimensions (WxH)/ (mm)
250x250
250*250
250*250
Panel material
Die-Casting Aluminum
Cabinet weight (kg/m²)
7.5
Color Grayscale ( Bit)
16bit
Refresh Rate( Hz)
7,680
Brightness( nits)
600
1,200
800-1,000
Optimal Horizontal Viewing Angle(˚)
160
160
160
Optimal Vertical Viewing Angle(˚)
160
160
160
Contrast ratio
4,000:1
15,000:1
4,000:1
AC Input Voltage(V)
AC:100V~240V
AC Input Power Maximum Value(W/m²)
650
400
650
AC Input Power Typical Value(W/m²)
220
150
220
Storage / Working Temperature(℃)
-30 ~ +60℃ / -20 ~ +50℃

Storage / Working Humidity ( RH)
10%~90%non-condensing
IP rating ( Front/Rear)
IP30
Certificate
CE/CB/ETL/FCC/ROHS


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